EVG 520IS UV-NIL Bo

Listing description

EVG 520IS UV-NIL BONDING SYSTEM consisting of:

- EVG 520IS Bond Chamber
- For UV Cured Adhesive Bonding/Embossing in Vacuum
- Accepts Substrates up to 200mm
- Configured with a Universal UV-NIL Embossing Chamber, High-Vacuum and High-Contact Force Capabilities
- Manages the Whole Range of Polymers suitable for Hot Embossing and NIL
- Together with High-Aspect Ratio Embossing and Multiple De-Embossing Options many Processes for High Quality Pattern Transfer and nm Resolution are Offered
- Manufactured in 2007!
- System Used Minimally and in Like-New Condition!

UV-VACUUM BOND MODULE:

- Bond Chamber for UV Cured Adhesive Bonding/Embossing in Vacuum
- Transparent Cover with Bellows for Uniform Contact Force Application up to 3.5kN
- Max Overpressure: 1 Atmosphere for Contactless Pressurization of Pre-Bonded Wafer Pairs
- Max Contact Force Created by One Atmosphere Pressure Differential (<14.5 PSI)
- Atmospheric Capabilities down to 1 x 10 -1 mbar (7.5 x 10 -2 Torr)
- Pump Time Capability < 1min from 1000 to 5 mbar
- Purge Time Capability < 10sec from high vacuum to 1 bar
- Heating Capability on Bottom Side Heater
- 1 UV-Lightsource
- 400W Light Source for UV-adhesive Curing (wave length 300-500 nm)
- Operations manual and documentation
- Refurbished by EVG Factory Trained Technicians
- Warranty on parts and labor
- Installation and Training Offered Worldwide

This equipment is located in US