EVG 850DB

Listing description

EVG 850DB WAFER DEBONDING SYSTEM consisting of:

- EVG850DB Automated Debonding System
- Wafer Processing System for Debonding, Cleaning and Unloading of Thin Wafers
up to 200mm
- Tooled for debonding of 150 mm Device Wafers from 150 mm Carrier Wafer
- SECS II / GEM - Hardware / Software Interface
- Hardware:
- Hardware (SEMI E4 or SEMI E37 connection) to be defined on order:
- Hardware interface RS232
- Hardware interface Ethernet TCP/IP
- Software:
- SEMI E5 - SEMI EQUIPMENT COMMUNICATIONS STANDARD 2 MESSAGE CONTENT (SECS-II)
- SEMI E30 - GENERIC MODEL FOR COMMUNICATIONS AND CONTROL OF
MANUFACTURING EQUIPMENT (GEM)
- Graphical User Interface for automated processing
- User interface including keyboard and monitor mounted in basic unit
- Additional user interface including keyboard and monitor implemented in external
rack
- Cassette Station
- Cassette present sensor
- Cassette empty sensor
- Adjustable for different semi standard wafer cassette sizes
- Endeffector for 150 mm Wafer
- Thin Wafer Endeffector for 150 mm Thin Wafer
- Standard Pre-Aligner
- Wafer ID Reader
- SEMI T1 (barcode), SEMI M12, SEMI M13 (both alphanumeric), SEMI T7 (data matrix code) compliant
- Software to read and log ID numbers from wafers
- For single sided reading
- Thermal Release Debond Module for up to 200 mm Wafer
- Rapid Cooling Capability for Top Side Heater
- Rapid Cooling Capability for Bottom Side Heater
- Debond Chuck Top Side for 150 mm Substrates
- Debond Chuck Bottom Side for 150 mm Substrates
- Cleaning Module
- Spinner Chuck for 150 mm Thin Wafers
- Venturi Ring for 150 mm Wafers
- Back Side Rinse (BSR) System for 150 mm Wafers
- Bypass DI-water system
- Chemistry line, Consisting of valve, flowmeter, needle valve and software
integration.
- Digital flow meter
- Tank for Solvents and Removers
- Chemistry Cabinet for up to 2 Chemicals
- 1 x pressurized tank per slot (9l/2gal or 20l/5gal volume, respectively)
- 1 x resist pump with up to 5l/1gal bottle per slot
- Film Frame Mounter
- Configured for one (1) frame size only
- Lamination Stage Chuck for 150 mm Wafer
- ThinWafer Flip Unit
- Chuck for Flip Unit for 150 mm Wafer Handling System for Film Frames
- Configured for one (1) cassette size only!
- Endeffector for Film Frames
- Closed loop cooling water supply
- Water to Water Heat Exchanger
- 2012 Vintage

This equipment is located in US