EVG 850TB

Listing description

EVG 850TB TEMPORARY WAFER BONDING SYSTEM consisting of:

- EVG850TB Automated Temporary Bonding System
- Wafer Processing System for Coating, Bake and Bonding of Wafers up to 200mm
- Tooled for bonding of 150 mm Device Wafers to 150 mm Carrier Wafer
- Wafer Mapping in Cassette
- SECS II / GEM - Hardware / Software Interface
- Hardware:
- Hardware (SEMI E4 or SEMI E37 connection) to be defined on order:
- SEMI E4 - SEMI EQUIPMENT COMMUNICATIONS STANDARD 1 MESSAGE TRANSFER (SECS-I)
- Hardware interface RS232
- SEMI E37 - HIGH-SPEED SECS MESSAGE SERVICES (HSMS) GENERIC SERVICES
- Hardware interface Ethernet TCP/IP
- Software:
- SEMI E5 - SEMI EQUIPMENT COMMUNICATIONS STANDARD 2 MESSAGE CONTENT (SECS-II)
- SEMI E30 - GENERIC MODEL FOR COMMUNICATIONS AND CONTROL OF MANUFACTURING EQUIPMENT (GEM)
- Endeffector for 150 mm Wafer
- Automatic rotating endeffector capability
- Standard Pre-Aligner
- Wafer ID Reader
- SEMI T1 (barcode), SEMI M12, SEMI M13 (both alphanumeric), SEMI T7 (data matrix code) compliant
- Software to read and log ID numbers from wafers
- For single sided reading
- Bond Chamber
- Standard Bond Chamber for wafer size up to 200mm
- Independently controlled Top- & Bottom side heater up to 350°C through double sided heating
- Vacuum system
- For processing in controlled atmosphere conditions.
- Process steps such as evacuation to ultimate vacuum, backfill with 2 independent purge gasses (e.g. N2, Ar, O2), and evacuation to controlled pressure are possible.
- Bond Chuck for 150 mm wafers
- Spin Coating Station
- PTFE spinner chamber
- Spinner Chuck for 150-200 mm wafer
- Hi-Torque motor for wide range of resist types
- Top Side Edge Bead Removal (EBR) System
- Back Side Rinse (BSR) System for 150 mm Wafers
- Tank for EBR / BSR Solvent
- Chemistry Cabinet for 4 Chemicals
- High Temperature Bake Module
- Buffer/Cooling station
- MFG Date: 2012

This equipment is located in US