Leica LMS IPRO Laser

Listing description

Year: 2003

Lecia

LMS IPRO

Critical Dimension Metrology Tool

S/N: 11 233 519

Product Condition:

USED

Specifications:

State-of-the-art technology with the latest generation X/Y pattern placement and critical dimension metrology tool from

Leica Microsystems. The new LMS IPRO2 (the name is an acronym for Laser Measurement System and Image Processing

of the 2nd generation) incorporates a CCD camera, combined with UV illumination (365 nm) in reflected or transmitted modes,

and a Hewlett-Packard laser interferometer system to acquire feature edge locations on photomasks, wafers or other types of

substrates. This edge information is used to generate reports on either pattern placement against an “ideal X/Y design

grid” or feature-critical dimension sizes. That means significantly reduced product cycle times as the two types of measurement

information are obtained simultaneously.

- Measurement Camera (HPO Camera)

- Laser Auto Focusing Electronics

- 15 position magazine loader with in/out feed pick & place robot.

- QTY of 2 5"x 5" wafer holders

- 6" wafer holdes

- Temperature and dehumidification controlled enclosure.

- Siemens Model 301-307.090.00 system controller

Visit manufacturer link below for complete product specifications:

http://schnelletexte.de/LeicaWafer_Johannes-Faupel_schnelletexte.de.pdf

This equipment is located in US