SPTS Multiplex ASE-H

Listing description

SPTS MULTIPLEX ASE-HRM ICP PRO ETCHER consisting of:

Configuration:
- Model: Multiplex ICP PRO
- Process Chamber: ASE-HRM
- ASE-HRM chamber: High Rate Magnetic source achieves over three times the etch rates versus the original Bosch process
- Process: deep silicon etch
- Operating sofware: Windows 2000 Professional
- Currently set to process: 150mm
- Max wafer size capable: 200mm
- Year of Manufacture: 2004

Vacuum Load-lock For Single Chamber Multiplex systems (MESC):
- MACS loader (cassette to cassette loader)
- Carousel Load Lock (150mm)
- Chamber lid temperature control
- Fully automatic transfer of substrates between the load-lock and the process chamber
- Loader may be configured for substrates up to 200mm in diameter (currently set for 150mm)

Multiplex ICP Process Chamber:
- Production proven single wafer process chamber (aluminium)
- Balun Coil for High Rate Etch
- Leybold MAG 2000 CT Turbo Pump
- VAT Pendulum Valve
- Backside Helium Cooling
- Electro-Static Chuck (ESC)
- Remote sealed extracted gas box with orbitally welded gas lines
- Electronics cabinet

- LCD flat panel monitor
- Fully automatic multistep processing or manual operation
- ENI ACG-6B RF High Frequency
- Advanced Energy LF-5 Low Frequency
- Spectrum B-3013 3kW 13.56 MHz
- Edwards iH80 Vacuum Pump (Load Lock)
- Edwards iH600 Vacuum Pump (Chamber)
- 2 Affinity Chillers
- System Cables (full set)
- System Power: 208V, 60Hz, 3PH
- CE Certified

- Gas Box with gas configuration as follows:
- Ar2 - 100 sccm
- O2 - 100 sccm
- C4F8 - 300 sccm
- SF6 - 600 sccm
- N2 - vent

- Operations Manuals, Electrical Drawings and Documentation (Complete Manual Set)
- Refurbished to excellent condition by SPTS factory trained technicians.

This equipment is located in US