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ASM AB 559A-06 P240901058
ASM AB 559A-06 P240901058

ASM AB 559A-06 Pick-and-place machine Verified seller

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Manufacturer ASM
Model AB 559A-06
Year 2008
Location Netherlands NL
Category PCB - Pick-and-place machines
Product id P240901058
Language
bg Машина за вземане и поставяне ASM AB 559A-06
cs Odsazovací stroj ASM AB 559A-06
da ASM AB 559A-06 Pick-and-place maskine
de ASM AB 559A-06 Bestückungsautomat
el Μηχάνημα επιλογής και τοποθέτησης ASM AB 559A-06
en ASM AB 559A-06 Pick-and-place machine
es Máquina de inserción ASM AB 559A-06
fr Machine de placement ASM AB 559A-06
hr Pick-and-place stroj ASM AB 559A-06
hu ASM AB 559A-06 Pick-and-place gép
it Assemblatrice SMT ASM AB 559A-06
lt Išrinkimo ir padavimo mašina ASM AB 559A-06
nl ASM AB 559A-06 Pick-and-place-machine
pl Maszyna do montażu powierzchniowego ASM AB 559A-06
pt Máquina de pegar e colocar ASM AB 559A-06
ro Mașină de ridicare și plasare ASM AB 559A-06
ru ASM AB 559A-06 Захватывающая установка
sr Mašina za biranje i postavljanje ASM AB 559A-06
sv ASM AB 559A-06 Pick-and-place-maskin
tr Al ve Yerleştir Makinası ASM AB 559A-06

Specifications

-------------------
Worked hours
Hours under power
State good
At local norms ---------
Status visible

Description

ASM AB 559A-06 is a high-performance, microprocessor-controlled wire tie machine designed for multi-point bonding of large-scale integrated circuit chips. The machine offers a range of features and capabilities that make it suitable for a variety of microelectronic chip assembly applications.

The ASM AB 559 A 06 is equipped with a precision pitch and yaw mechanism for accurate positioning and tensioning of bonding tool tips. It also incorporates dual-head ultrasonic, thermal compression and wedge welding systems to provide a full range of bonding capabilities. The machine also features a 13.6-inch color touch screen with advanced diagnostic, alphanumeric and graphic tools for enhanced performance and convenience.

The AB 559A-06 offers a compact design with a fully enclosed, dust-free base that helps keep the environment clean. Thanks to the wire size of 0.1-2.0 mm, adjustable bonding length and 5,000 bonding parameters, the machine is suitable for many types of chip assembly work. In addition, the device also features a range of productivity features, including customizable menus and automatic wire routing for easy setup and operation.

Additional features of the ASM AB 559A-06 include user-friendly real-time databases, advanced security features, and enhanced system monitoring capabilities. It is also designed with an ergonomic control panel and a user-friendly touchscreen interface for enhanced operation and convenience. Thanks to the built-in diagnostic system, users can quickly identify and address any issues. The ASM AB 559A-06 bonder is highly reliable and an excellent choice for any type of microelectronic chip assembly. It offers a wide range of features and performance capabilities that make it suitable for a variety of production scenarios. It is a powerful and accurate system that can deliver accurate and repeatable results on a production basis, enabling greater throughput and efficiency.

Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase


Client type Reseller
Active since 2019
Offers online 48
Last activity Nov. 14, 2024

Description

ASM AB 559A-06 is a high-performance, microprocessor-controlled wire tie machine designed for multi-point bonding of large-scale integrated circuit chips. The machine offers a range of features and capabilities that make it suitable for a variety of microelectronic chip assembly applications.

The ASM AB 559 A 06 is equipped with a precision pitch and yaw mechanism for accurate positioning and tensioning of bonding tool tips. It also incorporates dual-head ultrasonic, thermal compression and wedge welding systems to provide a full range of bonding capabilities. The machine also features a 13.6-inch color touch screen with advanced diagnostic, alphanumeric and graphic tools for enhanced performance and convenience.

The AB 559A-06 offers a compact design with a fully enclosed, dust-free base that helps keep the environment clean. Thanks to the wire size of 0.1-2.0 mm, adjustable bonding length and 5,000 bonding parameters, the machine is suitable for many types of chip assembly work. In addition, the device also features a range of productivity features, including customizable menus and automatic wire routing for easy setup and operation.

Additional features of the ASM AB 559A-06 include user-friendly real-time databases, advanced security features, and enhanced system monitoring capabilities. It is also designed with an ergonomic control panel and a user-friendly touchscreen interface for enhanced operation and convenience. Thanks to the built-in diagnostic system, users can quickly identify and address any issues. The ASM AB 559A-06 bonder is highly reliable and an excellent choice for any type of microelectronic chip assembly. It offers a wide range of features and performance capabilities that make it suitable for a variety of production scenarios. It is a powerful and accurate system that can deliver accurate and repeatable results on a production basis, enabling greater throughput and efficiency.

Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase

Specifications

-------------------
Worked hours
Hours under power
State good
At local norms ---------
Status visible

About this seller

Client type Reseller
Active since 2019
Offers online 48
Last activity Nov. 14, 2024

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ASM AB 559A-06 Pick-and-place machine