ASM AB 559A-06 Pick-and-place machine Verified seller

Description

ASM AB 559A-06 is a high-performance, microprocessor-controlled wire tie machine designed for multi-point bonding of large-scale integrated circuit chips. The machine offers a range of features and capabilities that make it suitable for a variety of microelectronic chip assembly applications.

The ASM AB 559 A 06 is equipped with a precision pitch and yaw mechanism for accurate positioning and tensioning of bonding tool tips. It also incorporates dual-head ultrasonic, thermal compression and wedge welding systems to provide a full range of bonding capabilities. The machine also features a 13.6-inch color touch screen with advanced diagnostic, alphanumeric and graphic tools for enhanced performance and convenience.

The AB 559A-06 offers a compact design with a fully enclosed, dust-free base that helps keep the environment clean. Thanks to the wire size of 0.1-2.0 mm, adjustable bonding length and 5,000 bonding parameters, the machine is suitable for many types of chip assembly work. In addition, the device also features a range of productivity features, including customizable menus and automatic wire routing for easy setup and operation.

Additional features of the ASM AB 559A-06 include user-friendly real-time databases, advanced security features, and enhanced system monitoring capabilities. It is also designed with an ergonomic control panel and a user-friendly touchscreen interface for enhanced operation and convenience. Thanks to the built-in diagnostic system, users can quickly identify and address any issues. The ASM AB 559A-06 bonder is highly reliable and an excellent choice for any type of microelectronic chip assembly. It offers a wide range of features and performance capabilities that make it suitable for a variety of production scenarios. It is a powerful and accurate system that can deliver accurate and repeatable results on a production basis, enabling greater throughput and efficiency.