Description
iXH6045H Dry Vacuum Pump
Product Overview
The iXH dry pump series is specifically designed for demanding processes in semiconductor manufacturing, flat panel displays, and solar applications. It offers a reduced cost of ownership with 10% less energy consumption compared to previous models. The pump features enhanced powder handling with Gas Buster™ technology, a wide operating temperature range to minimize by-product accumulation, and improved seal technology to extend pump life and reduce leakage risks.
Specifications
Model: ACHD02123300XS
Voltage: 380-460V
High Voltage: 6000V
Gas Module: Single mode (44 sL/min flow)
Exhaust: Standard without check valve
Seals: Standard
Pump Motor: 11 kW
Booster Motor: 7.5 kW
Applications
High-k and low-k applications
SACVD, LPCVD, ALD, TCO, GaN, and EPI processes
CVD, PECVD, and MOCVD
Strip/ashing, oxide etch, metal etch, and implant source
Technical Specifications
Dimensions:
Length: 1080 mm
Width: 517 mm
Height: 966 mm
Performance:
Pumping Speed: 5000 - 5200 m³/h
Ultimate Vacuum: < 5 x 10⁻³ mbar
Maximum Inlet Pressure: 1000 mbar
Cooling:
Water Flow Rate: 12 l/min
Water Supply Pressure: 6.9 bar (100 psig)
Key Features
High hydrogen pumping speeds ideal for advanced EPI and solar processes
Compact design with a smaller footprint for easy integration into fabrication facilities
Compliance with UL, CE, and S2 standards
This pump is optimized for demanding environments where enhanced process capability, energy efficiency, and a compact design are crucial. For further details and operational guidance, please refer to the complete product manual.
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