IEMME NEO FLOW 16 PCB Reflow oven Top seller

20,000 €

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Manufacturer	IEMME
Model	NEO FLOW 16
Year	2016
Location	Italy
Category	PCB - Reflow ovens
Product id	P240523124
Language	PCB Reflow пещ IEMME NEO FLOW 16 Přeformátovácí pec na PCB IEMME NEO FLOW 16 IEMME NEO FLOW 16 PCB Reflow ovn IEMME NEO FLOW 16 PCB Reflow Öfen Φούρνος ανανέωσης PCB IEMME NEO FLOW 16 IEMME NEO FLOW 16 PCB Reflow oven Horno de reflujo PCB IEMME NEO FLOW 16 Four à refusion PCB IEMME NEO FLOW 16 PCB Reflow pećnica IEMME NEO FLOW 16 IEMME NEO FLOW 16 PCB Reflow sütő Forno di rifusione IEMME NEO FLOW 16 PCB Reflow orkaitė IEMME NEO FLOW 16 IEMME NEO FLOW 16 PCB Reflow-oven Piec przelotowy PCB IEMME NEO FLOW 16 Forno de refluxo PCB IEMME NEO FLOW 16 Cuptor PCB Reflow IEMME NEO FLOW 16 IEMME NEO FLOW 16 Решетчатая печь для печатной платы PCB Reflov peć IEMME NEO FLOW 16 IEMME NEO FLOW 16 PCB Reflow ugn PCB reflow fırını IEMME NEO FLOW 16

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Worked hours
Hours under power
State	good
At local norms	yes
Status	visible

Description

The IEMME NEO FLOW is a modern reflow oven used in the electronics manufacturing industry, primarily for the soldering of surface mount technology (SMT) components onto printed circuit boards (PCBs). Reflow ovens are critical in the SMT assembly process as they heat the PCB and solder paste to a temperature that melts the solder, thereby creating strong electrical and mechanical connections between components and the PCB.

Key Features:
Multi-Zone Heating:

The NEO FLOW typically features multiple heating zones (both top and bottom) that can be individually controlled. This allows for precise thermal profiling, essential for ensuring that different parts of the PCB and various components are properly soldered.
Convection Heating:

Utilizes forced convection to uniformly distribute heat across the PCB. This method is efficient and effective in achieving consistent soldering results, reducing the chances of cold joints or overheating.
Profile Management:

Advanced thermal profiling capabilities allow users to create, store, and manage multiple thermal profiles. This flexibility is crucial for handling different types of PCBs and components with varying thermal requirements.
Energy Efficiency:

Designed with energy efficiency in mind, the NEO FLOW often incorporates features such as improved insulation and optimized airflow management to reduce energy consumption while maintaining high performance.
Cooling Zones:

Includes controlled cooling zones that gradually bring the temperature of the PCB down post-soldering, which is important to prevent thermal shock and ensure the integrity of the solder joints.
Flux Management System:

Equipped with a system to manage and remove flux residues that are released during the soldering process. This helps maintain a clean working environment and improves the longevity and reliability of the oven.
User-Friendly Interface:

Features an intuitive touch-screen interface for easy setup, monitoring, and control of the reflow process. This can lead to reduced training time and greater ease of use for operators.

***the description has been generated online and all the parameters should be double checked with the owner

Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase

Client type	Reseller
Active since	2019
Offers online	21
Last activity	Nov. 20, 2024

Description

Specifications

-------------------
Worked hours
Hours under power
State	good
At local norms	yes
Status	visible

About this seller

Client type	Reseller
Active since	2019
Offers online	21
Last activity	Nov. 20, 2024

IEMME NEO FLOW 16 PCB Reflow oven Top seller

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Description

Description

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About this seller

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IEMME NEO FLOW 16 PCB Reflow oven