Specifications

Capacity 18000 u/h
Type Automatic
-------------------
Worked hours
Hours under power
State revised
At local norms ---------
Status under power

Description

Topaz-X2 - Philips Pick & Place used.
Part of the GemLine (Modular High Speed Produccion Machines), the Topaz-X2 is a machine capable of handling a wide range of components at speeds of up to 18,000 SMDs per hour in a range from 01005 (0402) to 45 x 100 mm with an accuracy of 40 microns (QFP).

A flexible board transport system enables Topaz-X to handle virtually any type of PCB, with or without tooling pins. The width of the conveyor belt is automatically adjustable, allowing boards up to 460 x 440 mm (I 7.9″ x 17.2″) to be handled.

Full recovery

Model: Topaz X2 Philips

Category: Pick and Place/Power Supply

Model Year: 2003

Condition: refurbished
_________________________________

Optimum placement rate: 18,000 cph
Nominai placement rate: 12,000 - 14,000 cph
Applicable components: 020 I - SOP, SOJ, PLCC 32mm ( 1.26″)
6mm - QFP 32mm (1.26″) with pin pitch up to 0.5mm (20 mii)
Dark bottom BGA, μBGA, CSP with regular heights;
6 mm - 32 mm: min. ball pitch up to 0.75 mm (31 mii}, min.
ball diameter up to 0.3 mm (I 2mil)
6mm - QFP 32mm (1.26″) with pin pitch up to 0.4mm (16 mii)
Dark bottom BGA, μBGA,CSP with regular heights;
6mm - 32mm: min. ball pitch up to 0.75mm (31 mii}, min.
ball diameter up to 0.3 mm (I 2mil)
Fitting accuracy (XY) 3σ: ± 50μ for chip and SOIC
± 40μ for QFP (6mm - 32mm 1.26″) with pin pitch up to 0.5mm (20 mii)
± 35μ for QFP (6mm - 32mm 1.26″) with pin pitch up to 0.4mm ( 16 mii)
Mounting accuracy
(φ):

For Chips and SOIC this depends on lead
± 0.6° for QFP (6 mm - 32 mm 1.26″) with pin pitch up to 0.5 mm (20 mii)
± 0.09° for QFP (6 mm - 32 mm 1.26″) with pin pitch up to 0.4 mm (16 mii)
Mounting angle: O up to 360 (programmable in steps of O.O I )
Mounting repeatability: X, Y 30μ for QFP (6mm - 32mm 1.26″) 0.4 Phi (0.09°) pitch
Number of heads: A single beam with 4 Flying Nozzle change heads and 4 standard heads
Alignment system: one line array camera with front and side illumination system for
On-the-fly vision using the VICS 2500 processing system
Area CCD camera for QFP 32mm ( 1.26″) with pin pitch
up to 0.4 mm (16 mii)
Mobile CCD camera for Confidence! alignment
Optional:

Dual multi-camera front and rear bank
Nozzle station
FES trolley
8 standard heads

Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase


Client type Reseller
Active since 2023
Offers online 11
Last activity Nov. 12, 2024

Description

Topaz-X2 - Philips Pick & Place used.
Part of the GemLine (Modular High Speed Produccion Machines), the Topaz-X2 is a machine capable of handling a wide range of components at speeds of up to 18,000 SMDs per hour in a range from 01005 (0402) to 45 x 100 mm with an accuracy of 40 microns (QFP).

A flexible board transport system enables Topaz-X to handle virtually any type of PCB, with or without tooling pins. The width of the conveyor belt is automatically adjustable, allowing boards up to 460 x 440 mm (I 7.9″ x 17.2″) to be handled.

Full recovery

Model: Topaz X2 Philips

Category: Pick and Place/Power Supply

Model Year: 2003

Condition: refurbished
_________________________________

Optimum placement rate: 18,000 cph
Nominai placement rate: 12,000 - 14,000 cph
Applicable components: 020 I - SOP, SOJ, PLCC 32mm ( 1.26″)
6mm - QFP 32mm (1.26″) with pin pitch up to 0.5mm (20 mii)
Dark bottom BGA, μBGA, CSP with regular heights;
6 mm - 32 mm: min. ball pitch up to 0.75 mm (31 mii}, min.
ball diameter up to 0.3 mm (I 2mil)
6mm - QFP 32mm (1.26″) with pin pitch up to 0.4mm (16 mii)
Dark bottom BGA, μBGA,CSP with regular heights;
6mm - 32mm: min. ball pitch up to 0.75mm (31 mii}, min.
ball diameter up to 0.3 mm (I 2mil)
Fitting accuracy (XY) 3σ: ± 50μ for chip and SOIC
± 40μ for QFP (6mm - 32mm 1.26″) with pin pitch up to 0.5mm (20 mii)
± 35μ for QFP (6mm - 32mm 1.26″) with pin pitch up to 0.4mm ( 16 mii)
Mounting accuracy
(φ):

For Chips and SOIC this depends on lead
± 0.6° for QFP (6 mm - 32 mm 1.26″) with pin pitch up to 0.5 mm (20 mii)
± 0.09° for QFP (6 mm - 32 mm 1.26″) with pin pitch up to 0.4 mm (16 mii)
Mounting angle: O up to 360 (programmable in steps of O.O I )
Mounting repeatability: X, Y 30μ for QFP (6mm - 32mm 1.26″) 0.4 Phi (0.09°) pitch
Number of heads: A single beam with 4 Flying Nozzle change heads and 4 standard heads
Alignment system: one line array camera with front and side illumination system for
On-the-fly vision using the VICS 2500 processing system
Area CCD camera for QFP 32mm ( 1.26″) with pin pitch
up to 0.4 mm (16 mii)
Mobile CCD camera for Confidence! alignment
Optional:

Dual multi-camera front and rear bank
Nozzle station
FES trolley
8 standard heads

Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase


Specifications

Capacity 18000 u/h
Type Automatic
-------------------
Worked hours
Hours under power
State revised
At local norms ---------
Status under power

About this seller

Client type Reseller
Active since 2023
Offers online 11
Last activity Nov. 12, 2024

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