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Rehm Compact Nitro 2300 P211208021
Rehm Compact Nitro 2300 P211208021

Rehm Compact Nitro 2300 PCB Reflow oven Verified seller

3,000 €

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Manufacturer Rehm
Model Compact Nitro 2300
Year 2004
Location Czech Republic CZ
Category PCB - Reflow ovens
Product id P211208021
Language
bg Rehm Compact Nitro 2300
cs Horkovzdušná přetavovací pec Rehm Compact Nitro 2300/400
da Rehm Compact Nitro 2300
de Rehm Compact Nitro 2300 PCB Reflow Öfen
el Rehm Compact Nitro 2300
en Rehm Compact Nitro 2300 PCB Reflow oven
es Horno de reflujo PCB Rehm Compact Nitro 2300
fr Four à refusion PCB Rehm Compact Nitro 2300
hr Rehm Compact Nitro 2300
hu Rehm Compact Nitro 2300
it Forno di rifusione Rehm Compact Nitro 2300
lt Rehm Compact Nitro 2300
nl Rehm Compact Nitro 2300
pl Piec przelotowy PCB Rehm Compact Nitro 2300
pt Rehm Compact Nitro 2300
ro Rehm Compact Nitro 2300
ru Rehm Compact Nitro 2300 Решетчатая печь для печатной платы
sr Rehm Compact Nitro 2300
sv Rehm Compact Nitro 2300
tr PCB reflow fırını Rehm Compact Nitro 2300

Specifications

Power supply (Volts) 400 V
Cooling unit Yes
-------------------
Weight 2000 kg
Worked hours
Hours under power
State excellent
At local norms ---------
Status

Description

temperature: 200-210 ° C
transfer speed: max. 1000 mm / min
total power consumption: 50 kw
Soldering equipment for printed circuit boards (eg Type: SMD and / or composite design) and SMD drying adhesive.
Can be integrated into a production line.
Further technical details:
- possibility of inert gas with nitrogen 30 m³ / h; 6 - 10 bar overpressure
- water demand: 20 liters / min; 2 - 5 bar overpressure
- exhaust volume: 1000 m³ / h

Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase


Client type User – small or medium company
Active since 2021
Offers online 1
Last activity June 26, 2024

Description

temperature: 200-210 ° C
transfer speed: max. 1000 mm / min
total power consumption: 50 kw
Soldering equipment for printed circuit boards (eg Type: SMD and / or composite design) and SMD drying adhesive.
Can be integrated into a production line.
Further technical details:
- possibility of inert gas with nitrogen 30 m³ / h; 6 - 10 bar overpressure
- water demand: 20 liters / min; 2 - 5 bar overpressure
- exhaust volume: 1000 m³ / h

Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase

Specifications

Power supply (Volts) 400 V
Cooling unit Yes
-------------------
Weight 2000 kg
Worked hours
Hours under power
State excellent
At local norms ---------
Status

About this seller

Client type User – small or medium company
Active since 2021
Offers online 1
Last activity June 26, 2024

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Rehm Compact Nitro 2300 PCB Reflow oven