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Ssec M3302 P240304602
Ssec M3302 P240304602
Ssec M3302 P240304602
Ssec M3302 P240304602
Ssec M3302 P240304602
Ssec M3302 P240304602
Ssec M3302 P240304602
Ssec M3302 P240304602

SSEC 3302 Resist Removal and Wafer Cleaning Machine

Price on request

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Manufacturer Ssec
Model M3302
Year
Location USA US
Category Semiconductor - Wafer equipment
Product id P240304602
Language
bg SSEC 3302 Машина за отстраняване на съпротивление и почистване на пластини
cs SSEC 3302 Stroj na odstraňování rezistů a čištění destiček
da SSEC 3302 maskine til fjernelse af resist og rengøring af wafere
de SSEC 3302 Resistentfernungs- und Waferreinigungsmaschine
el SSEC 3302 Μηχανή αφαίρεσης αντιστάσεων και καθαρισμού πλακιδίων
en SSEC 3302 Resist Removal and Wafer Cleaning Machine
es SSEC 3302 Máquina de eliminación de resistivos y limpieza de obleas
fr SSEC 3302 Machine à enlever les résistances et à nettoyer les plaquettes
hr SSEC 3302 Stroj za uklanjanje i čišćenje pločica
hu SSEC 3302 reziszt eltávolító és ostyatisztító gép
it SSEC 3302 Macchina per la rimozione delle resistenze e la pulizia dei wafer
lt SSEC 3302 Atsparumo pašalinimo ir plokštelių valymo mašina
nl SSEC 3302 Resistverwijderings- en waferreinigingsmachine
pl SSEC 3302 Maszyna do usuwania rezystancji i czyszczenia wafli
pt SSEC 3302 Máquina de remoção de resistência e limpeza de bolachas
ro SSEC 3302 Mașină de îndepărtare a rezistenței și de curățare a plăcilor
ru SSEC 3302 Машина для удаления резиста и очистки пластин
sr SSEC 3302 Mašina za uklanjanje otpornika i čišćenje pločica
sv SSEC 3302 Maskin för borttagning av resist och rengöring av wafers
tr SSEC 3302 Direnç Sökme ve Gofret Temizleme Makinesi

Specifications

-------------------
Worked hours
Hours under power
State good
At local norms ---------
Status

Description

SSEC CLEAN 3300

MODEL: M3302

208 VAC, 3PH, 60Hz, 30 AMP

Date of Mfg. 8/30/05

AC Dwg No. 330i1712



1) the wafer is soaked in the mix of solvents (so-called cleaning by submersion)

2) there is processing by spray solvents ( so-called Fan Spray Processing) and nitrogen drying stage.

The unit has so-called dry-in/dry-out system (dry wafers in/ dry wafers out).



Post DRIE etch TSV cleaning is essential to the reliability of 2.5D and 3D IC devices. SSEC’s proprietary

soak and spray technology minimizes spray time and chemistry use for lower cost-of-ownership than

conventional wet bench or single spray approaches; it achieved 100% photoresist and sidewall

fluoropolymer removal 5x faster than spray only.



The tool features equal-time soak software for process control. Each wafer soaks in heated, recirculating

solvent long enough to penetrate the polymer residue. Following wet transfer to the spray station, the

wafer is subject to a high-pressure spray to rapidly remove remaining residue. The result is 100%

photoresist and polymer removal. Soak and spray takes 88% less time and 77.5% less chemistry than

spray-only processes.

Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase


Client type Reseller
Active since 2014
Offers online 24
Last activity Sept. 11, 2024

Description

SSEC CLEAN 3300

MODEL: M3302

208 VAC, 3PH, 60Hz, 30 AMP

Date of Mfg. 8/30/05

AC Dwg No. 330i1712



1) the wafer is soaked in the mix of solvents (so-called cleaning by submersion)

2) there is processing by spray solvents ( so-called Fan Spray Processing) and nitrogen drying stage.

The unit has so-called dry-in/dry-out system (dry wafers in/ dry wafers out).



Post DRIE etch TSV cleaning is essential to the reliability of 2.5D and 3D IC devices. SSEC’s proprietary

soak and spray technology minimizes spray time and chemistry use for lower cost-of-ownership than

conventional wet bench or single spray approaches; it achieved 100% photoresist and sidewall

fluoropolymer removal 5x faster than spray only.



The tool features equal-time soak software for process control. Each wafer soaks in heated, recirculating

solvent long enough to penetrate the polymer residue. Following wet transfer to the spray station, the

wafer is subject to a high-pressure spray to rapidly remove remaining residue. The result is 100%

photoresist and polymer removal. Soak and spray takes 88% less time and 77.5% less chemistry than

spray-only processes.

Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase

Specifications

-------------------
Worked hours
Hours under power
State good
At local norms ---------
Status

About this seller

Client type Reseller
Active since 2014
Offers online 24
Last activity Sept. 11, 2024

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SSEC 3302 Resist Removal and Wafer Cleaning Machine