Specifications

-------------------
Weight 3 kg
Worked hours
Hours under power
State good
At local norms ---------
Status

Description

Optical System

Imaging Method Dynamic Imaging with true 3D profile measurement
Top Camera 4 Mpix
Angle Camera N/A
Imaging Resolution 10 µm, 15 µm ( optional )
Lighting Multi-phase RGB+W LED
3D Technology Single/Dual 3D laser sensors
Max. 3D Range 20 mm

Inspection Performance

Imaging Speed
4 Mpix@ 10 µm 2D: 60 cm²/sec
4 Mpix@ 15 µm 2D: 120 cm²/sec
4 Mpix@ 10 µm 2D+3D: 27-39 cm²/sec*
4 Mpix@ 15 µm 2D+3D: 40-60 cm²/sec*
* Depending on board size and laser resolution

Motion Table & Control

X-Axis Control Ballscrew + AC-servo controller
Y-Axis Control Ballscrew + AC-servo controller
Z-Axis Control N/A
X-Y Axis Resolution 1 µm

Board Handling

Max PCB Size TR7700 SIII 3D: 510 x 460 mm
PCB Thickness 0.6-5 mm
Max PCB Weight 3 kg
Top Clearance 25 mm
Bottom Clearance 40 mm
Edge Clearance 3 mm ( 5 mm optional )

Conveyor
Inline
Height: 880 – 920 mm
* SMEMA Compatible

Inspection Functions

Component

Missing
Tombstoning
Billboarding
Polarity
Rotation
Shift
Wrong Marking (OCV)
Defective
Upside Down
Extra Component
Foreign Material
Lifted Component

Solder

Excess Solder
Insufficient Solder
Bridging
Through-hole Pins
Lifted Lead
Golden Finger
Scratch/Contamination

Dimensions

WxDxH TR7700 SIII 3D: 1100 x 1670 x 1550 mm
Note: not including signal tower, signal tower height 520 mm
Weight TR7700 SIII 3D: 1030 kg

Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase


Client type Reseller
Active since 2018
Offers online 46
Last activity Oct. 16, 2024

Description

Optical System

Imaging Method Dynamic Imaging with true 3D profile measurement
Top Camera 4 Mpix
Angle Camera N/A
Imaging Resolution 10 µm, 15 µm ( optional )
Lighting Multi-phase RGB+W LED
3D Technology Single/Dual 3D laser sensors
Max. 3D Range 20 mm

Inspection Performance

Imaging Speed
4 Mpix@ 10 µm 2D: 60 cm²/sec
4 Mpix@ 15 µm 2D: 120 cm²/sec
4 Mpix@ 10 µm 2D+3D: 27-39 cm²/sec*
4 Mpix@ 15 µm 2D+3D: 40-60 cm²/sec*
* Depending on board size and laser resolution

Motion Table & Control

X-Axis Control Ballscrew + AC-servo controller
Y-Axis Control Ballscrew + AC-servo controller
Z-Axis Control N/A
X-Y Axis Resolution 1 µm

Board Handling

Max PCB Size TR7700 SIII 3D: 510 x 460 mm
PCB Thickness 0.6-5 mm
Max PCB Weight 3 kg
Top Clearance 25 mm
Bottom Clearance 40 mm
Edge Clearance 3 mm ( 5 mm optional )

Conveyor
Inline
Height: 880 – 920 mm
* SMEMA Compatible

Inspection Functions

Component

Missing
Tombstoning
Billboarding
Polarity
Rotation
Shift
Wrong Marking (OCV)
Defective
Upside Down
Extra Component
Foreign Material
Lifted Component

Solder

Excess Solder
Insufficient Solder
Bridging
Through-hole Pins
Lifted Lead
Golden Finger
Scratch/Contamination

Dimensions

WxDxH TR7700 SIII 3D: 1100 x 1670 x 1550 mm
Note: not including signal tower, signal tower height 520 mm
Weight TR7700 SIII 3D: 1030 kg

Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase


Specifications

-------------------
Weight 3 kg
Worked hours
Hours under power
State good
At local norms ---------
Status

About this seller

Client type Reseller
Active since 2018
Offers online 46
Last activity Oct. 16, 2024

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