Description
Optical System
Imaging Method Dynamic Imaging with true 3D profile measurement
Top Camera 4 Mpix
Angle Camera N/A
Imaging Resolution 10 µm, 15 µm ( optional )
Lighting Multi-phase RGB+W LED
3D Technology Single/Dual 3D laser sensors
Max. 3D Range 20 mm
Inspection Performance
Imaging Speed
4 Mpix@ 10 µm 2D: 60 cm²/sec
4 Mpix@ 15 µm 2D: 120 cm²/sec
4 Mpix@ 10 µm 2D+3D: 27-39 cm²/sec*
4 Mpix@ 15 µm 2D+3D: 40-60 cm²/sec*
* Depending on board size and laser resolution
Motion Table & Control
X-Axis Control Ballscrew + AC-servo controller
Y-Axis Control Ballscrew + AC-servo controller
Z-Axis Control N/A
X-Y Axis Resolution 1 µm
Board Handling
Max PCB Size TR7700 SIII 3D: 510 x 460 mm
PCB Thickness 0.6-5 mm
Max PCB Weight 3 kg
Top Clearance 25 mm
Bottom Clearance 40 mm
Edge Clearance 3 mm ( 5 mm optional )
Conveyor
Inline
Height: 880 – 920 mm
* SMEMA Compatible
Inspection Functions
Component
Missing
Tombstoning
Billboarding
Polarity
Rotation
Shift
Wrong Marking (OCV)
Defective
Upside Down
Extra Component
Foreign Material
Lifted Component
Solder
Excess Solder
Insufficient Solder
Bridging
Through-hole Pins
Lifted Lead
Golden Finger
Scratch/Contamination
Dimensions
WxDxH TR7700 SIII 3D: 1100 x 1670 x 1550 mm
Note: not including signal tower, signal tower height 520 mm
Weight TR7700 SIII 3D: 1030 kg
Please note that this description may have been translated automatically. Contact us for further information. The information of this classified ad are only indicative. We recommend to check the details with the seller before a purchase