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- High Speed bondhead with AC servo motion control
- Configurable 2 in 1 epoxy writer or stamping system
- Dispenser/ stamper on XY table for fine adjustment
- Automatic die theta alignment at wafer stage
- PR look ahead capability
- Advanced die surface defect inspection at wafer stage
- Pre-bond and post-bond inspection
This equipment is located in MY
Manufacturer | Asm Ad8930 Die |
Model | ASM AD8930 |
Year | - |
Country | Malaysia |
Condition | Good |
Main category | PCB and SMT equipment |
Subcategory | Semiconductor Equipment |
ID | P81004004 |
Client type | Machinery dealer |
On Kitmondo since | 2018 |
Number of listings | 0 |
Country | Malaysia |
Last activity | Oct. 9, 2018 |