ASM Eagle XP5 PEALD Wafer machine

Listing description

Wafer Size 300 mm
Process PE-ALD System
Software Version Eagle I ASMJ software (Windows embedded XP / OS)
See the configuration file below to download along with other documents.
Full set of schematics available on request.
Process PE-ALD Oxide, HT-SiO/HT-SiN
Hardware Configuration (fab):
Main System ASM PE-ALD System Mainframe 1
Handler System FI: Kawasaki / Vac: JEL 1
Factory Interface FOUP 2
Options System
Others Process Chamber (RC3 / RC4) 2
Hardware Configuration (subfab/ auxiliary units):
Power Rack 1
Tool Status: Deinstalled and crated and in storage. (March 2023)

The ASM Eagle is like new. It was never used in Production and only used to test wafers. One chamber had a throttle valve issue and RF Gen issue. The RF Gen was replaced but they did not replace the throttle valve so only one chamber was used to test the wafers. The liquid gas panel was not used. There are 2 spare MFCs included.

This advanced machine utilizes plasma-enhanced atomic layer deposition (PEALD) technology to create ultra-thin, uniform coatings on a variety of substrate materials. It is capable of producing coatings with exceptional uniformity and reproducibility, making it ideal for a wide range of applications in the semiconductor industry.
The ASM Eagle XP5 is a versatile tool that can be used to deposit a wide range of materials, including metals, oxides, and other compounds. It is also capable of operating at a range of process pressures and temperatures, making it suitable for use in a variety of manufacturing environments.
In addition to its impressive coating capabilities, the ASM Eagle XP5 is also built with durability and ease of maintenance in mind. It has a robust design and is backed by ASM's reputation for producing high-quality, reliable equipment.

This equipment is located in IE