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Highly productive and always aiming for zero defects: the fully automatic, compact wire bonder SPRINT-T 01 was adapted to the special requirements of mass production of power semiconductors and power modules in the automotive industry.
This equipment is located in MY
Manufacturer | Sprint |
Model | SPRINT-T 01 HIGH SPEED AUTOMATIC WIRE BONDER |
Year | 2012 |
Country | Malaysia |
Condition | Good |
Main category | PCB and SMT equipment |
Subcategory | Wire Bonder |
ID | P21010019 |
Client type | End User |
On Kitmondo since | 2022 |
Number of listings | 29 |
Country | Malaysia |
Last activity | April 24, 2024 |
Contact | Click here |