Showing 21 - 40 out of 94
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LAM Lower Electrode Condition: Refurbished PN: 718-092326-082-1 LA8PPF For Flat wafer ( not notch)Year:
Olympus CX21 Phase Microscope Like New condition 10X Eye pieces 4x, 10x, 40x objectivesYear:
Millipore ACX3200 ACX3201 Throttle Valve Controller Set Included in this set: Millipore ACX3200 Millipore MDV018 Throttle Gate Valve The Millipore ACX3200 Throttle Valve Controller Set includes the ACX3200 controller and the MDV018 Throttle Gate Valve. This set is designed for precise control of fluid flow in the laboratory or industrial settings. The ACX3200 controller offers advanced features such as a …Year:
The EDB65 is an easy-to-use reliable manual bonder which ensures high placement accuracy for all laboratory applications, prototype, preproduction and limited production work. It can be quickly reconfigured to accept all common semiconductor packages and operates in manual mode at up to 300 units per hour. DIE HANDLING AND PLACEMENT: The die pickup head load is adjustable, providing very low …Year:
DYNAPERT Emhart 200 Axial Inserting Machine 220 V 50 HzYear:
DAGE MICROTESTER Wire Bond Pull/Shear Tester Model BT22Year:
The EDB65 is an easy-to-use reliable manual bonder which ensures high placement accuracy for all laboratory applications, prototype, preproduction and limited production work. It can be quickly reconfigured to accept all common semiconductor packages and operates in manual mode at up to 300 units per hour. DIE HANDLING AND PLACEMENT: The die pickup head load is adjustable, providing very low …Year:
The contact angle meter provides information on the adhesion energy of the solid surface and the surface tension of the drop. It has been widely accepted for material surface analysis related to wetting, adhesion and absorption. It is used to detect the presence of films, coatings or contaminants with a surface energy different from that of the underlying substrate. It …Year:
THERMO BONDING MACHINES (only spare parts) Wire bonderYear: 1994
Wire size range, stranded 0.14 – 6mm² (AWG 25 – 10) Wire size range, solid 0.14 – 2.0mm² (AWG 25 – 14) Outer wire diameter max. 6mm Pull-off length max. 1. side 30mm Pull-off length max. 2. side 100mm Programmable total length 10 mm – 100 m Feeding speed 0 – 60 m/min, infinitely adjustable incl. printer LeibingerYear: 1996
Model: PlasmaLab 80 Plus,PECVD Plasmalab 80+ DPCVD Category: PECVD, Semiconductor Process equipment Original Equipment Manufacturer: Oxford,PlasmaLab Condition: Fully Refurbished and Tested by seller Location: U.S.A. Installation and training: Available at extra charge.Year:
Model: 600 SemiAuto - Semi-Automatic RF Plasma System - Can process up to 200mm wafers - Used for photoresist stripping and surface cleaning, as well as etching silicon and its compounds - Chamber Size: 245mm diameter, 380mm depth - Chamber Material: ceramic - ENI RF Generator: 0-600 Watt, 13.56 MHz - Gases: 4 channels controlled by 4 MFCs - Leybold …Year: 1995
Model: JETFIRST 100 -RTP Category: RTP – Rapid Thermal Processing Original Equipment Manufacturer: Jipelec Condition:Fully Refurbished and Tested by seller Location: U.S.A. Installation and training: Available at extra charge.Year: 1987
Model: Branson/IPC 3000,2000,4000 Series Category: Plasma Asher, Semiconductor Process equipment Original Equipment Manufacturer: Branson/IPC Condition: Fully Refurbished and Tested by seller Location: U.S.A. Installation and training: Available at extra charge.Year: 2007
Model: SAVANNAH S200-ALD ATOMIC LAYER DEPOSITION SYSTEM Category: ATOMIC LAYER DEPOSITION SYSTEM ,semiconductor process equipment Original Equipment Manufacturer: SAVANNAH,CAMBRIDGE NANOTECH , Veeco Cambridge Nanotech Ultratech Condition: Complete, working and Tested by seller Location: U.S.A. Installation and training: Available at extra charge.Year: 2000
AnnealSys AS-One Rapid Thermal Processor. unit is used . low hour , clean super condition. 4 inch. Rapid Thermal Processing furnaces for the development of rapid thermal annealing and CVD processes Wafer Size: Up to 4 inch. Model: AnnealSys AS-One Category: RTP – Rapid Thermal Processing Original Equipment Manufacturer: AnnealSys Condition:Fully Refurbished and Tested by seller Location: U.S.A. Installation and …Year:
Advanced Energy RFX600 13.56mhz RF power supply 1 ground and 1 powered shelf Leybold vacuum pumpYear:
PLC controlled and offers real-time plain English readout of system operating parameters together with remedial action in the event of an abort. Active Plasma for routine cleaning of sample surfaces RIE Plasma for aggressive cleaning of non ESD sensitive samples Downstream, Electron-Free Plasma for cleaning sensitive electronic components The Glen R3A Plasma Cleaner can be operated in a single or …