Máy kiểm tra Glass của điện thoại di động

Year: 2018

Thiết bị có nhiều camera độ phân giải cao, chụp ảnh và đánh giá chất lượng sản phẩm kính điện thoại Phone Glass Inspection 3D

USed TRI TR7700SIII SMT 3D AOI Inspection System

Year: 2017

Optical System Imaging Method Dynamic Imaging with true 3D profile measurement Top Camera 4 Mpix Angle Camera N/A Imaging Resolution 10 µm, 15 µm ( optional ) Lighting Multi-phase RGB+W LED 3D Technology Single/Dual 3D laser sensors Max. 3D Range 20 mm Inspection Performance Imaging Speed 4 Mpix@ 10 µm 2D: 60 cm²/sec 4 Mpix@ 15 µm 2D: 120 cm²/sec …

Used SAKI BF-Planet-XII AOI SMT Inspection Machine

Year: 2016

BF-Planet-XII SAKI In-line High Resolution and High Speed AOI SMT Inspection Machine Features In-line 2D AOI Max PCB size is 330x250mm for BF-Planet-XII, 500x460mm for BF-FrontierII, 870x686mm for BF-10Z BF-Planet-XII’s scanning time is only 4 seconds BF-Planet-XII’s compact body of only 60cm width System Specifications Resolution 10um Board Size 50×60 – 250×330mm, 2×2.4 – 10×13in. Board Thickness 0.6 – 3.2mm, …

Used SAKI BF-3Di-L1 3D Automated Optical Inspection

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Dimensions 1040 (W) x 1530 (D) x 1500 (H) mm (BF-3Di-L1) (40.94 W x 60.24 D x 59.06 H in.) Maintenance Space 1m in front of the machine, 1m in rear of the machine, 1m in side of the machine Weight Approx. 950 kg (2094.39 lb) Usage Environment Temperature: 15 to 30 degree C, Humidity: 15 to 80 %RH (Non …

Used TRI TR7007M SII Plus SMT SPI

Year:

Optical System Imaging Method Dynamic Imaging Camera 4M pixel camera Imaging Resolution 10 um or 15 um (factory setting) Lighting RGB LED 3D Technology 2-way Fringe Pattern Field of View 4 Mpix@ 10 um: 20 x 20 mm 4 Mpix@ 15 um: 30 x 30 mm Inspection Performance Imaging Speed 4 Mpix@ 10 um: 90 cm2/sec 4 Mpix@ 15 um: …

TEL P12XL Prober

Year:

Conversion Kits : 8”/12” Chuck : Hot/Air Cool OCR : Cognex 1700/SIO VIP Option : VIP3/VIP3A Condition : Working HDD Including

EG 4090U+ Prober

Year:

ELECTROGLAS / EG 4090u+ is a high-performance, ultra-accurate, ultra-high resolution prober used in the semiconductor industry for probing and testing semiconductor chips and die. It is capable of testing devices in a wide range of sizes and shapes with extremely high accuracy and repeatability. EG 4090 U+ includes a variety of integrated advanced features including a 3D scanner for detailed …