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Configuration de type Aspen II Dual ICP - AGV :
1. Plate-forme de cassette : Rotation de cassette ou nid de cassette monobloc standard
2. Refroidissez la chambre : Installé, nouveau type
3. Porte fendue : Nouveau type
4. Ensemble robot. : Standard, Nouveau type
5. Porte cassette : AGV 26"
6. Générateur RF : AE /RFPP ou Adtec X 4
7. Bloc de chauffage/refroidissement : réchauffeur, nouveau type avec motif à rainures circulaires ou plaque de refroidissement par eau avec refroidisseur
8. Boîte d'adaptation RF : Trazar AMU 10D X 4
9. Gaz : 3 gaz ou 4 gaz
10. Boîte à gaz : Nouveau type
11. EMO arrière
12. Refroidir la chambre avec Hindge
13. Interface opérateur à distance.
14. wafer sur les capteurs à palette installés.
15. Conforme CE
Détails Taille de plaquette : 4", 6" ou 8" configurable.
This equipment is located in TW
Fabricant | Mattson |
Modèle | Aspen II Dual ICP - AGV type |
Année | - |
Pays | Taïwan |
Condition | Bonne |
Catégorie | PCB et semi-conducteur |
Sous-catégorie | Autres semi-outils |
ID | P30406043 |
Type de client | Marchand |
Sur Kitmondo depuis | 2013 |
Nombre d'offres | 6 |
Pays | Taïwan |
Employés | 11 - 50 |
Fondée en | 9 |
Description de l'entreprise |
The company has been doing in Inductively Coupled Plasma (ICP)technology and used Mattson Aspen 2 system refurbish for several years. Our company has got the advanced plasma technology in the wor… voir plus The company has been doing in Inductively Coupled Plasma (ICP)technology and used Mattson Aspen 2 system refurbish for several years. Our company has got the advanced plasma technology in the world. We are specialized in semiconductor and LED process technology & equipment. We focus our clients on the fields of LED, Semiconductors (Front end and Back end), Printed circuit boards (PCB), etc, and provide the key technologies to the rapidly developing semiconductor and LED industry. In order to achieve our goal to keep in the lead of advanced plasma technologies and have a sustainable development, we develop new techniques continuously to improve the performance for our customers. To enhance our R&D ability and competitiveness, we also collaborate with National Nano Device Laboratories to commercialize our R&D results and help our customers to develop the advanced plasma clean, PR stripping, Descum and organic removal process, etc. . We solve the problems that our customers meet in the process of phot-resist removal ,Descum and plasma clean, etc. Even see their needs in the future plasma process of 6 ~8 inches LED and semiconductor. Thus, we can assist customers to develop the top technologies in the world without relying on foreign expensive equipments. Furthermore, making educational training to customers is also a highlight of our strategies. To enhance customer’s understanding of machine and process, we would like to offer training form the basic theories of plasma and material to electricity & mechanics theories |
Dernière acitivité | avr. 6, 2023 |
Contact | Cliquer ici |