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Aspen II Dual ICP - Configurazione tipo AGV:
1. Piattaforma della cassetta: rotazione della cassetta o nido della cassetta di un pezzo standard
2. Camera di raffreddamento: installata, nuovo tipo
3. Porta a fessura: nuovo tipo
4. Gruppo robot. : Standard, Nuovo tipo
5. Porta cassetta: AGV 26"
6. Generatore RF: AE/RFPP o Adtec X 4
7. Blocco di riscaldamento/raffreddamento: riscaldatore, nuovo tipo con motivo a scanalatura circolare o piastra di raffreddamento ad acqua con refrigeratore
8. Scatola di corrispondenza RF: Trazar AMU 10D X 4
9. Gas: 3 gas o 4 gas
10. Gas Box: Nuovo tipo
11. EMO posteriore
12. Camera di raffreddamento con Hindge
13. Interfaccia operatore remoto.
14. Wafer sui sensori a paletta installati.
15. Conformità CE
Dettagli Dimensioni wafer: 4", 6" o 8" configurabili.
This equipment is located in TW
Produttore | Mattson |
Modello | Aspen II Dual ICP - AGV type |
Anno | - |
Paese | Taiwan |
Condizione | Buono |
Categoria principale | PCB e semiconduttori |
Sottocategoria | Altri semi strumenti |
ID | P30406043 |
Tipo di cliente | Rivenditore di macchinari |
Su Kitmondo dal | 2013 |
Numero di annunci | 6 |
Paese | Taiwan |
Dipendenti | 11 - 50 |
Stabilito | 9 |
Descrizione dell'azienda |
The company has been doing in Inductively Coupled Plasma (ICP)technology and used Mattson Aspen 2 system refurbish for several years. Our company has got the advanced plasma technology in the wor… leggere altro The company has been doing in Inductively Coupled Plasma (ICP)technology and used Mattson Aspen 2 system refurbish for several years. Our company has got the advanced plasma technology in the world. We are specialized in semiconductor and LED process technology & equipment. We focus our clients on the fields of LED, Semiconductors (Front end and Back end), Printed circuit boards (PCB), etc, and provide the key technologies to the rapidly developing semiconductor and LED industry. In order to achieve our goal to keep in the lead of advanced plasma technologies and have a sustainable development, we develop new techniques continuously to improve the performance for our customers. To enhance our R&D ability and competitiveness, we also collaborate with National Nano Device Laboratories to commercialize our R&D results and help our customers to develop the advanced plasma clean, PR stripping, Descum and organic removal process, etc. . We solve the problems that our customers meet in the process of phot-resist removal ,Descum and plasma clean, etc. Even see their needs in the future plasma process of 6 ~8 inches LED and semiconductor. Thus, we can assist customers to develop the top technologies in the world without relying on foreign expensive equipments. Furthermore, making educational training to customers is also a highlight of our strategies. To enhance customer’s understanding of machine and process, we would like to offer training form the basic theories of plasma and material to electricity & mechanics theories |
Ultima attività | Aprile 6, 2023 |
Contatti | Fai clic qui |